Okulaba Ebintu Ebikulu

Firimu ya grafayiti esaasaanya ebbugumu-ekintu eky’omulembe eky’okuddukanya ebbugumu ekizimbibwa ku nsengekera ya kirisitaalo ya grafayiti etunudde ennyo. Ekozesa tekinologiya ow’okutambuza ebbugumu mu njuyi bbiri okusobozesa okusaasaana kw’ebbugumu okw’amangu ku mabbali n’okutambuza ebbugumu mu nneekulungirivu, okuvvuunuka obuzibu bw’okusaasaanya ebbugumu ery’ebintu eby’ennono. Omuwendo gwayo omukulu guli mu kutuusa obutambuzi bw’ebbugumu obw’amaanyi ennyo mu ngeri egonvu ennyo (micrometer-level), etali ya maanyi nnyo ate nga ekuuma okukyukakyuka, ekigifuula esaanira ebifo ebizibu ebikoona n’ebifo ebizibiddwa.

Ebipimo by’ebyekikugu

Obugumu (mm) .	Obugazi (mm) .	Obuwanvu (m) .	Obuzito (g/cm3) .	Ebirimu kaboni	Obutambuzi bw’ebbugumu [W/(m·K)].
0.05	500	100	1.5–1.75	99.5–99.9	300–450
0.06	500	100	1.5–1.8	99.5–99.9	400–500
0.08	500	100	1.5–1.8	99.5–99.9	400–500
0.1	500	100	1.5–1.85	99.5–99.9	400–500
0.12	500–1000	100	1.5–1.85	99.5–99.9	400–500
0.15	500–1000	100	1.5–1.85	99.5–99.9	400–500
0.2	500–1000	100	1.5–1.85	99.5–99.9	400–500

Weetegereze: Ekintu kiwagira okulongoosa

Ebirungi Ebikulu mu Bikozesebwa

Efficient Heat Uniformization : Olw’obutafaanagana bwayo obw’amaanyi mu-ennyonyi, ekyusa mangu ebbugumu erikuŋŋaanyiziddwa okuva mu nsonda nga chips okudda mu kugabanya okwa kimu, okuziyiza okukendeera kw’omulimu olw’ebbugumu erisukkiridde mu kitundu-kikulu nnyo mu mbeera z’amaanyi amangi-nga 5G base stations ne AI chips.
Obugonvu, Obutangaavu, n’Okwesigamizibwa : Nga density yaayo 1/4 ku 1/10 ey’ekyuma, ekendeeza ku buzito bw’ekyuma. Era ekuuma omulimu ogutebenkedde ogw’ekiseera ekiwanvu-mu bbugumu erisukkiridde (-diguli 40 okutuuka ku diguli 85 ) era eyita mu kugezesebwa okulwanyisa okukaddiwa.
Design Flexibility : Kiyinza okugattibwa n’ebintu nga PI films ne copper foils, okuwagira okulongoosa okw’okubiri (okugeza, die-okusala, adhesive backing) okutuukiriza ebyetaago eby’obuntu eby’enjawulo-shaped structures ne electromagnetic shielding.
Obukuumi eri obutonde: Halogen-terimu era esobola okuddamu okukozesebwa, etuukana n’omutindo gwa RoHS, eyamba okukola dizayini ya kaboni omutono-mu bintu eby’amasannyalaze.

Ennimiro z’Okusaba

Consumer Electronics : Smartphones (okugeza, foldable screen hinge heat dissipation), tablets, VR/AR glasses-okukola ku kusoomoozebwa kw'ebbugumu okuva mu chips ezigatta ennyo ne modulo za screen. -
5G & Communications : Base station radio frequency modules, optical modules-okukola ku nsonga z'ebbugumu ezeekuusa ku nkozesa y'amasannyalaze ezeyongera-mu byuma bya 5G.
Amasoboza Amapya & Emmotoka : Okukuuma bbaatule y’amaanyi okuva mu bbugumu, mu-enkola z’okusanyusa abantu mu mmotoka-okutumbula obukuumi n’okugumiikiriza okutebenkera kw’emmotoka empya ez’amaanyi.
Industrial & Medical : LED lighting driver modules, sensa z'ebyuma eby'obujjanjabi-okukakasa enkola eyesigika ey'ekiseera ekiwanvu-ebyuma.

Omuwendo gw’Ekigonjoola

Nga etunuulidde ebyetaago bya "okukola obulungi, okukendeeza, n'obulamu bwa bbaatule obuwanvu" mu byuma eby'amasannyalaze eby'omulembe, firimu eno elongoosa dizayini y'okusaasaanya ebbugumu ng'eyita mu nkola ya "heat source shielding + heat conduction" dual mechanism:

Enhances Product Competitiveness : Ekendeeza ku miwendo gy'okulemererwa n'okwongeza ku bulamu bw'empeereza, okunyweza end-erinnya ly'akatale k'ebyuma. -
Shortens R&D Cycles : Egatta emizingo egy’omutindo n’empeereza ezikoleddwa ku mutindo okusobola okukwatagana amangu n’okuddiŋŋana kwa dizayini ya bakasitoma.
Adapts to Emerging Technologies : Mu bintu ebiyiiya nga screens foldable ne flexible displays, ultra-flexibility yaayo (tewali kukendeeza ku mutindo oluvannyuma lw'okubeebalama 600,000) kuwa obuyambi bw'ebintu eri okumenyawo ebintu mu biseera eby'omu maaso.